CURRICULUM VITAE
  • Name : AZMAN BIN JALAR @ JALIL
  • Qualifications :
    PhD (Metallurgy and Materials)
  • Specialisation :
    Physical Metallurgy, Mechanical Metallurgy, Microstructure and properties of metals and alloys
  • Areas of Research :

    Superplasticity of metals and alloys. Plastic deformation of metals and alloys. Semiconduktor Packaging - metallurgy. Microstructure-property relationship. Annealing and related phenomena. Aluminium alloys. Metallography

  • Current Projects and Grants :
     

    Bil

    Tajuk

    Tempat Penyelidikan

    Status

    Sumber Kewangan

    1.

    ST0052003 ,  Kajian Kesuperplastikan Aloi Aluminium Komersil Siri 6000

    UKM

    Ketua

    RM17500.00

    2.

    09-02-02-0107-EA259 , Under bump metallurgy (UBM) materials in area array packaging

    UKM

    Penyelidik bersama

    RM142000.00

    3.

    09-02-02-0118-EA295 , Development of high strenght and high corrosion resistant light alloys of Al-Mg-Si for automotive body skin, Aktif

    UKM

    Penyelidik Bersama

    RM185000.00

    4.

    03-02-02-0122-PR001 , The development of surface mount/PCB material technology for power IC packages

    UKM

    Ketua Projek

    RM1,410,000.00

    5.

    03-02-02-0124-PR001 , The characterization and development of IC encapsulants

    UKM

    Penyelidik Bersama

    RM4,450,000.00

  • Selected Publications :
     
    1. Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar and Ghazali Omar, 2006, Effect of Laminated Wafer Toward Dicing Process and Alternative Double Pass Sawing Method to Reduce Chipping, IEEE Transactions on Electronic Packaging Manufacturing, Vol. 29, No 1, January 2006, pp 17-24

    1. Mohd Khairudin Md Arshad, Ibrahim Ahmad, Azman Jalar, Ghazali Omar, 2006, The Surface Characteristics of Under Bump Metallurgy (UBM)in electroless Nickel Immersion Gold (ENIG) Deposition, Microelectronic Reliability, Vol. 46, pp 367-379

    1. Shahrul Nizam Shahdan, Azman Jalar and Muhammad Azmi Abdul Hamid, 2006, Microstructure of Solder Joint in Used Mobile Phone, Materials Science Forum, Vol. 517, pp. 123-128

    1. Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar and Ghazali Omar, 2006, Effect of Wafer Thinning Methods Towards Fracture Strength and Topography of Silicon Die, Microelectronic Reliability, Vol. 46, pp 836-845.

    1. Ahmad, TS Chin, CK Cheong, A. Jalar and I. Abdullah, 2005, Study of Fiber Surface Treatment on Reinforcment/Matrix Interaction in Twaron Fiber/ENR Composites, American Journal of Applied Sciences, Special Issue, 14-20

    6. Mohd Khairudin Md arshad, Ibrahim Ahmad, Azman Jalar, Ghazali Omar, 2005, The effect of Organic Photoresist layer to Parasitic Residual in Electroless Deposition Under Bump Metallurgy, Journal of Solid State Science& Technology Letters, Vol.12, No. 1&2, pp 12-17

    1. Azman Jalar, Ishatirradzah Mustaffa and Ibrahim Ahmad, 2004, Some aspect of grain growth in AA6061 Aluminium Alloy, Journal of Solid State Science and Technology Letters, Vol. 11, No. 1, 210-214

    8. M.A. Abdul Hamid, T.J. Bullough, R. Shamsudin and A. Jalar, 2001, Laser Assisted Deposition on GaAs using Chemical Beam Epitaxy, Journal Institute of Materials Malaysia, Vol 2 (2) July, 02, 45-50

     

  • Contact Information :
    - Address
      SCHOOL OF APPLIED PHYSICS
      FACULTY OF SCIENCE & TECHNOLOGY
      Universiti Kebangsaan Malaysia
      43600 UKM Bangi
      Selangor
      Malaysia
    - Phone Number
      03 89213873
    - Fax Number
      0389213777
    - E-mail